JOB Requirement
1.Bachelor degree in Packing/mechanical Engineering or relative fields
本科学历，工科专业背景
2.Minimun 3 years working experience in packing/process engineering of semiconductor
三年半导体测试包装或工艺相关经验
3.Understand the process flow for semiconductor industrial especial for test/packing
熟悉半导体测试工艺流程
4.Be familiar with SPC, FEMA, Control plan, Packing flow, BOM
熟悉SPC,FEMA等分析工具，熟悉质量控制流程及BOM表
5.Good English in oral and written
英文良好
6.Good quality sense
良好的品质意识
JOB Description
1.Take charge of the responsibility of finishing, packing and labeling for new customer business
负责新客户产品包装及标签等相关事宜。
2.Develop, maintain and continuously improve the finishing line process including, quality issue, technical parameter, flow chart, FEMA, control plan and BOM etc
开发、维护并持续改善产品工艺，处理质量问题、技术参数、流程图、fema、控制计划和bom表等。
3.Organize and implement quality improvement projects in finishing and test
组织实施Finishing工序及测试质量改进项目
4.SOP preparing for Test process, VM, packing and labeling
测试流程、vm、包装和标签的sop准备