1. Min Bachelor degree
2. Min 5year working experience for SMT process
3. Capability for jig design(stencil, reflow jig)
4. Understanding material property for SMT process such as solder paste, sintering material, epoxy material, cleaning checmical
5. Hands on skill for SMT process equipment(Infotech multi die bonder, Pink and SMT vacuum reflow machine, sinter die attach machine)
6. Experience for flux cleaning process, sinter die attach process
7. At least middle level English communication and reporting skill
8. Well known FMEA/control plan and process DOE including JMP analysis
苏州 - 昆山
昆山利百瑞电子科技有限公司苏州 - 昆山
昆山富成科精密电子有限公司苏州 - 常熟
苏州良基电子科技有限公司苏州 - 昆山
昆达电脑科技(昆山)有限公司苏州 - 虎丘
毅嘉电子(苏州)有限公司苏州 - 吴江
千思跃智能科技(苏州)股份有限公司